OUR CAPABILITIES

IF YOU CAN DESIGN IT, WE CAN ASSEMBLE IT

We have assembled over 40,000 unique designs in the last decade and we’re always looking for more. Due to our advanced operational capacity and nearly limitless flexibility, we can take on more than anyone else in the industry, while still producing the highest quality boards.

Advanced Assembly’s Full Operating Capabilities Include:

  • Low to Mid-Volume Board Assembly

  • Larger Quantity Board Assembly

  • SMT and Thru-Hole
  • Press Fits
  • Parts in Any Format
  • ISO 9001:2015
  • Passives Down to 01005
  • Ball Grid Array (BGAs) and VFBGA
  • Box Build
  • Leadless Chip Carriers / CSP
  • Double-Sided SMT Assembly
  • Fine Pitch to 08 Mils
  • BGA Repair and Reball
  • Part Removal and Replacement
  • Printed Circuit Boards: smallest 0.25″ x 0.25″
  • Printed Circuit Boards: largest 20″ x 24″
  • RoHS and Leaded
  • Flying probe, 3D BGA X-Ray and functional testing
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TOOLS & EQUIPMENT

Our cutting-edge facility has the latest technology and equipment, based on customer demands and leading industry trends.